W25Q256FVBIG
Manufacturer: Winbond
The W25Q256FVBIG is an SPI NOR Flash memory from Winbond. Density is 256 Mbit. Organisation is 32Mx8. Supply voltage is 2.7 – 3.6 V. Offered in the TFBGA24-8x6 package. Rated operating temperature is Industrial. Parameters above are taken from the manufacturer datasheet; confirm the current revision before finalising a design.
Overview
Winbond lists the W25Q256FVBIG as a 256 Mbit SPI NOR Flash memory with a TFBGA24-8x6 package, a 32Mx8 organisation, the Industrial temperature grade and a supply of 2.7 – 3.6 V.
During board bring-up, because density, interface and package are fixed by the ordering code, the complete part number should be confirmed before a design is released.
Key features
- 256 Mbit memory density
- 32Mx8 Organisation
- 2.7 – 3.6 V supply voltage
- TFBGA24-8x6 package
- Operating temperature range Industrial
- Winbond original part, traceable supply
Typical applications
- Embedded code storage
- IoT devices
- Automotive modules
- Networking equipment
- Industrial HMI
- Consumer electronics
- Motor control firmware
Specifications
Memory array
| Density | 256 Mbit |
|---|---|
| Organisation | 32Mx8 |
Interface and supply
| Voltage | 2.7 – 3.6 V |
|---|---|
| Operating temperature | Industrial |
Ordering
| Package | TFBGA24-8x6 |
|---|---|
| Ordering code | W25Q256FVBIG |
Note on parameters. The figures above are taken from the manufacturer datasheet for W25Q256FVBIG. Electrical limits vary by ordering option and revision — confirm the current datasheet before finalising your design.
Package and ordering
| Ordering code | Package | Operating temp. / grade |
|---|---|---|
| W25Q256FVBIG | TFBGA24-8x6 | Industrial |
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Sourcing W25Q256FVBIG
We supply W25Q256FVBIG with original manufacturer documentation and a quotation that states lead time, packaging and price breaks. Send your annual quantity and target date and you will get a reply with the datasheet attached.