W25Q128FWYIC
Manufacturer: Winbond
The W25Q128FWYIC is an SPI NOR Flash memory from Winbond. Density is 128 Mbit. Organisation is 16Mx8. Supply voltage is 1.65 – 1.95 V. Offered in the 32-ball WLCSP package. Rated operating temperature is Industrial. Parameters above are taken from the manufacturer datasheet; confirm the current revision before finalising a design.
Overview
The W25Q128FWYIC from Winbond is a 128 Mbit SPI NOR Flash memory. Key figures include 32-ball WLCSP packaging, an Industrial temperature grade, a 16Mx8 organisation and a supply range of 1.65 – 1.95 V.
The interface mode follows the part number, so the suffix should be matched to the bus actually used on the board.
Key features
- 128 Mbit memory density
- 16Mx8 Organisation
- 1.65 – 1.95 V supply voltage
- 32-ball WLCSP package
- Operating temperature range Industrial
- Winbond original part, traceable supply
Typical applications
- Embedded code storage
- IoT devices
- Automotive modules
- Networking equipment
- Industrial HMI
- Consumer electronics
- Motor control firmware
Specifications
Memory array
| Density | 128 Mbit |
|---|---|
| Organisation | 16Mx8 |
Interface and supply
| Voltage | 1.65 – 1.95 V |
|---|---|
| Operating temperature | Industrial |
Ordering
| Package | 32-ball WLCSP |
|---|---|
| Ordering code | W25Q128FWYIC |
Note on parameters. The figures above are taken from the manufacturer datasheet for W25Q128FWYIC. Electrical limits vary by ordering option and revision — confirm the current datasheet before finalising your design.
Package and ordering
| Ordering code | Package | Operating temp. / grade |
|---|---|---|
| W25Q128FWYIC | 32-ball WLCSP | Industrial |
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Sourcing W25Q128FWYIC
We supply W25Q128FWYIC with original manufacturer documentation and a quotation that states lead time, packaging and price breaks. Send your annual quantity and target date and you will get a reply with the datasheet attached.