W25Q128FVBIG
Manufacturer: Winbond
The W25Q128FVBIG is a SPI NOR Flash device from Winbond. Density is 128 Mbit. Organisation is 16Mx8. Supply voltage is 1.7 – 1.95 V. Offered in the TFBGA24-8x6 package. Rated operating temperature is Industrial. Parameters above are taken from the manufacturer datasheet; confirm the current revision before finalising a design.
Overview
Key features
- 128 Mbit memory density
- 16Mx8 Organisation
- 1.7 – 1.95 V supply voltage
- TFBGA24-8x6 package
- Operating temperature range Industrial
- Winbond original part, traceable supply
Typical applications
- Embedded code storage
- IoT devices
- Automotive modules
- Networking equipment
- Industrial HMI
- Consumer electronics
- Motor control firmware
Specifications
Memory array
| Density | 128 Mbit |
|---|---|
| Organisation | 16Mx8 |
Interface and supply
| Voltage | 1.7 – 1.95 V |
|---|---|
| Operating temperature | Industrial |
Ordering
| Package | TFBGA24-8x6 |
|---|---|
| Ordering code | W25Q128FVBIG |
Note on parameters. The figures above are taken from the manufacturer datasheet for W25Q128FVBIG. Electrical limits vary by ordering option and revision — confirm the current datasheet before finalising your design.
Package and ordering
| Ordering code | Package | Operating temp. / grade |
|---|---|---|
| W25Q128FVBIG | TFBGA24-8x6 | Industrial |
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Sourcing W25Q128FVBIG
We supply W25Q128FVBIG with original manufacturer documentation and a quotation that states lead time, packaging and price breaks. Send your annual quantity and target date and you will get a reply with the datasheet attached.