W25M512JVCIQ
Manufacturer: Winbond
The W25M512JVCIQ is a SPI NOR Flash device from Winbond. Density is 512 Mbit. Organisation is 2 x256M-bit. Supply voltage is 2.7 – 3.6 V. Offered in the TFBGA24-8x6 package. Rated operating temperature is Industrial. Parameters above are taken from the manufacturer datasheet; confirm the current revision before finalising a design.
Overview
Key features
- 512 Mbit memory density
- 2 x256M-bit Organisation
- 2.7 – 3.6 V supply voltage
- TFBGA24-8x6 package
- Operating temperature range Industrial
- Winbond original part, traceable supply
Typical applications
- Embedded code storage
- IoT devices
- Automotive modules
- Networking equipment
- Industrial HMI
- Consumer electronics
- Motor control firmware
Specifications
Memory array
| Density | 512 Mbit |
|---|---|
| Organisation | 2 x256M-bit |
Interface and supply
| Voltage | 2.7 – 3.6 V |
|---|---|
| Operating temperature | Industrial |
Ordering
| Package | TFBGA24-8x6 |
|---|---|
| Ordering code | W25M512JVCIQ |
Note on parameters. The figures above are taken from the manufacturer datasheet for W25M512JVCIQ. Electrical limits vary by ordering option and revision — confirm the current datasheet before finalising your design.
Package and ordering
| Ordering code | Package | Operating temp. / grade |
|---|---|---|
| W25M512JVCIQ | TFBGA24-8x6 | Industrial |
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Sourcing W25M512JVCIQ
We supply W25M512JVCIQ with original manufacturer documentation and a quotation that states lead time, packaging and price breaks. Send your annual quantity and target date and you will get a reply with the datasheet attached.